Prototype printed circuit boards are quite complex, and each separate board is created with a specific purpose in mind. This can mean anything from having a board as small as one layered, to small batch pcb assembly made with numerous different layers.
The problem with all of these layers is that there is a lack of space for the engineers to work. This is where blind and buried vias come in as a means to save space but not compromise components.
Here is a beginner guide on these interesting techniques for pcb fabrication and assembly.
What is the difference between blind and buried vias?
A blind via is a copper hole that connects only one outer layer to one or more inner layered. These are only used to connect one component, and you are able to see the connection when it is on the board.
A buried via is also copper plated, but it connects one or more outer layers to one or more inner layers. Simply put, these are used most often if there are multiple components, as these vias cannot be seen by the naked eye as they are buried underneath the outer layers of the pcb.
However, both of these vias do require a special separate drill file, so if you are considering this technique for prototype assembly, you have to be prepared.
What are the advantages of utilizing the blind and buried via technique?
- It does not get in the way of the surface mount components that are necessary for the PCB to function. Meaning they can offer more processing power for a smaller area without compromising any fabrication techniques.
- The SMD layers are able to be placed over the buried vias, and you won’t have to worry about compromising processing.
- It is cost-effective in the long run as while it may take extra time at first to create, but since there are more components you are able to sell your PCBs for a higher price.
As one can see, blind and buried vias are great from small batch PCB assembly. Contact your nearest PCB manufacturer to learn more. See this reference for more. Check out this website for more.